2013 high-tech LED assembly package special large family photoelectric He Yunbo talk about welding wire core technology
[High-tech LED reporter / Zhou Jin] welding wire as a key link in the LED packaging process, the quality of the LED directly determines the quality of the LED device.
This tests the equipment manufacturer's mastery of the bonding process. Most of the dead lights on the market today are caused by unstable soldering.
In recent years, the package structure and process have changed in the same direction, but the wire bonding technology has always played an important role. Domestic packaging equipment has always occupied a small share in the high-tech front-end wire bonding machine market, and the side also reflects the lack of competitiveness of domestic high-end packaging equipment in core technology.
As the first national enterprise in China to fully grasp the core technology of wire bonding machine, the first authoritative supplier to fully realize the nationalization of a complete set of LED packaging equipment, Dazu Optoelectronics successfully filled the gap of domestic wire bonding machine technology and seized the domestic packaging equipment. Market share provides an important force. There is a lot of experience in wire bonding technology that is worth learning from the industry.
In response to the key wire bonding technology issues, in 2013, the high-tech LED assembly packaged devices, equipment and materials special, on the afternoon of November 25, He Yunbo, general manager of Dazu Optoelectronics, will give a special speech on the theme of "welding wire technology and wire bonding machine development analysis" And share with the peers the technical achievements of Dazu Optoelectronics in this regard.
“The wire bonding technology is developed with the continuous evolution of packaging technology. The transformation of wire bonding materials is an important aspect of the development of wire bonding technology. The emergence of palladium-plated copper wire has greatly promoted the development of wire bonding technology and reduced the packaging. Cost." He Yunbo said.
At present, the wire bonding technology has been developed to a higher level, but the requirements for the thin and short package and functional integration of the package have not stopped, and the future welding wire technology will develop to a higher level.
As a domestic packaging equipment supplier, He Yunbo said that providing customers with comprehensive system solutions, improving the technical threshold of products and reducing the procurement cost of equipment will be the development trend of the future packaging equipment industry.
>>>CTO conference agenda can be found at: http://#xxyc
This tests the equipment manufacturer's mastery of the bonding process. Most of the dead lights on the market today are caused by unstable soldering.
In recent years, the package structure and process have changed in the same direction, but the wire bonding technology has always played an important role. Domestic packaging equipment has always occupied a small share in the high-tech front-end wire bonding machine market, and the side also reflects the lack of competitiveness of domestic high-end packaging equipment in core technology.
As the first national enterprise in China to fully grasp the core technology of wire bonding machine, the first authoritative supplier to fully realize the nationalization of a complete set of LED packaging equipment, Dazu Optoelectronics successfully filled the gap of domestic wire bonding machine technology and seized the domestic packaging equipment. Market share provides an important force. There is a lot of experience in wire bonding technology that is worth learning from the industry.
In response to the key wire bonding technology issues, in 2013, the high-tech LED assembly packaged devices, equipment and materials special, on the afternoon of November 25, He Yunbo, general manager of Dazu Optoelectronics, will give a special speech on the theme of "welding wire technology and wire bonding machine development analysis" And share with the peers the technical achievements of Dazu Optoelectronics in this regard.
“The wire bonding technology is developed with the continuous evolution of packaging technology. The transformation of wire bonding materials is an important aspect of the development of wire bonding technology. The emergence of palladium-plated copper wire has greatly promoted the development of wire bonding technology and reduced the packaging. Cost." He Yunbo said.
At present, the wire bonding technology has been developed to a higher level, but the requirements for the thin and short package and functional integration of the package have not stopped, and the future welding wire technology will develop to a higher level.
As a domestic packaging equipment supplier, He Yunbo said that providing customers with comprehensive system solutions, improving the technical threshold of products and reducing the procurement cost of equipment will be the development trend of the future packaging equipment industry.
>>>CTO conference agenda can be found at: http://#xxyc
| CTO Conference Packaging Devices, Equipment and Materials I (Heng Rui Zhida Title) | ||
| November 25th, 15:20-16:20 Conference Room D, Hall 5, Guangzhou Poly World Trade Center | ||
| Moderator: Xiao Congqing | ||
| Time Time | Topic | Speaker Speaker |
| 15:20-15:40 | Keynote Speech I: Wire bonding machine, no better, only better | Sponsor: Dr. He Yunbo, General Manager of Dazu Optoelectronics |
| 1. Analysis of development of welding wire technology and development of the industry | ||
| 2. The core technology and advantages of Dazu Optoelectronics | ||
| 3, Dazu photoelectric plane welding machine & straight wire bonding machine series introduction | ||
| 15:40-16:00 | Keynote Speech II: Doing "Stupid" Modern Automation Service | Sponsor: Sanyi Lianguang |
| 1. Change the mistrust of domestic equipment | ||
| 2, how to do good after-sales service | ||
| 16:00-16:20 | Keynote Speech III: Let customers no longer buy imported equipment | Sponsor: Huateng Semiconductor |
| 1, product line, technical service, collaborative development, one can not be less | ||
| 2, the price is definitely not the killer for customers to place orders | ||
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